Shop E Store One of the key elements of Apple’s A-series and M-series chips is their system-on-chip (SoC) design, which tightly integrates all components within a single package. This includes both CPU and GPU.
However, a new report suggests that the M5 Pro chip may take a different approach with more separation between the CPU and GPU to improve performance and increase production yields…
System-on-chip approach
Traditional computers and computer-like devices have completely separate CPUs (central processing units) and GPUs (graphics processing units), often on completely separate circuit boards.
With the iPhone, Apple integrated the two with an approach known as System-on-a-Chip (SoC). What were essentially completely separate chips are now combined into a single, tightly integrated unit containing both circuits. This approach has been replicated in other devices, such as the M-series chips for Apple Silicon Macs.
Whether you consider this a single chip or a compact package of various chips is largely a matter of semantics, but Apple has made a single chip, like the A18 Pro and M4 chips, point.
M5 Pro chip with separate CPU and GPU
For the M5 Pro chip, Apple will use TSMC’s latest chip packaging process known as SoIC-mH (System-on-Integrated-Chips-Molding-horizontal), according to Apple analyst Ming-Chi Kuo. He plans to use it.
SoIC-mH refers to a method of integrating various chips into a package in a way that improves thermal performance. This allows the chip to run at full power for longer periods of time before having to throttle back to reduce heat. It is also reported to reduce chips that fail quality control and improve production yields.
According to Kuo’s report, this approach will be used for the M5 Pro, Max, and Ultra versions of the next M5 chip.
The M5 series chips employ TSMC’s advanced N3P node and entered the prototype stage several months ago. Mass production of the M5, M5 Pro/Max, and M5 Ultra is scheduled to begin in the first half of 2025, second half of 2025, and 2026, respectively.
The M5 Pro, Max, and Ultra utilize a server-grade SoIC package. To improve production yields and thermal performance, Apple uses 2.5D packaging called SoIC-mH (molded horizontal), which allows the CPU and GPU to be designed separately.
Interestingly, it was previously reported that the iPhone 18 would also begin separating out various elements of the A-series chips, but that report pointed to the RAM that is currently integrated into the chip.
Also used to power Apple Intelligence servers
Kuo also hinted that the M5 Pro chip will be used in Apple Intelligence servers, known as private cloud computing (PCC).
Apple’s PCC infrastructure buildout will accelerate after mass production of its high-end M5 chips, which are better suited for AI inference.
Image: Michael Bower/9to5Mac
